HIMS semiconductor IR inspection machine use industrial infrared rays to detect defects inside semiconductor chips.

With the application of the highest-performance vision system and self-developed inspection algorithms, the inspection accuracy and productivity have been significantly improved.

This equipment is designed to handle ‘PCB Strip’.

Specification

HIMS semiconductor IR inspection machine use industrial infrared rays to detect defects inside semiconductor chips.

With the application of the highest-performance vision system and self-developed inspection algorithms, the inspection accuracy and productivity have been significantly improved.

This equipment is designed to handle and to inspect chips on ‘waffle chip tray’.

Specification

HIMS semiconductor IR inspection machine use industrial infrared rays to detect defects inside semiconductor chips.

With the application of the highest-performance vision system and self-developed inspection algorithms, the inspection accuracy and productivity have been significantly improved.

This equipment is designed to handle and to inspect chips on ‘Jedec type IC tray’.

Specification

HIMS wafer bump inspection system uses a 2D mono camera to detect wafer defects and perform measurements. It is a model that can perform both enhanced appearance inspection and measurements, such as pad size and wafer edge exposure inspection.

We have significantly reduced inspection time by improving the movement efficiency of the XY stage, generating high-speed triggers, and increasing the algorithm processing speed.

In addition, we provide improved production and analysis tools such as SPC and RMS to help with yield and defect analysis and improve productivity.

Specification

The CPI-300(PS) system is a system that inspects defects on the upper (Glass Side) and lower (Pellicle Side) surfaces of the reticle for the lithographic photo-mask process.

Specification

AOI system that uses 2D/3D cameras to inspect the aspect of chips and components.

It is available to perform 2D inspections of components, solder defects, chip defects, and foreign materials, as well as 3D inspections of components and die abnormal tilt.

Specification