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THE CUTTING EDGE TECHNOLOGY OF MACHINE VISION SYSTEMS

THE ADVANCED OPTICAL & INSPECTION TECHNOLOGY

Semiconductor Field
Here are our main products on semiconductor field.

Photo-mask/Pellicle Inspector

VISION SYSTEMS
APPLICATION

We’re advancing to the finest quality product with high technology and abiding faithfulness.
Functional Specification [Stand Alone]
  • Barcode reading unit - Code 39, ITF, Industrial 2-of-5
  • SMIF l/O -RSP 150/200 Reticle SMlF POD
  • Material used & surface finished are
    - Stainless Steel
    - Anodized Aluminum
    - ESD safe synthetic material
  • FFU & Chemical filter
    - 0.1㎛ Particle filter, 99.99995% efficiency at 100fpm
    - NH₃3 a filter for chemical concentration in the chamber
Performance Specification
inspection items ≥5.0Defects:G / IDUV,KrF,ArfofBinary / PSM
Repeatability ≥97%SPL
Throughput 40s/Reticle
Inspection area 150㎜×125㎜
Dimension/ Weight 828(W) × 356(D) × 732(H)
Light Source Laser 660㎜,100mWClassⅢb
Review Microscope Glass(Top) / Pellicle(Bottom) side
Optional BCR Reader, RFID R / Writer, Filter

Pattern Wafer Inspector Model : HWI-100

VISION SYSTEMS
APPLICATION

We’re advancing to the finest quality product with high technology and abiding faithfulness.
Bare Wafer Inspector
  • Basic Spec.
    Defect Size : 0.2㎛
    Inspection Time : 10min/sheet
Patterned Wafer
  • Basic Spec.
    Defect Size : 0.2㎛
    Inspection Time : 7min/sheet
Proto-Type
  • Basic Spec.
    Defect Size : 70㎛
    Inspection Time : 5min/sheet
Specification(Base on 8inch wafer)
Type Machine Size(㎜) Throughput Sensitivity Detector FOV Auto Focusing Pre-Aligner Illumination Review applied
Bare Water 1370×850×1880 15sheet/hr(4min) 65mm High Speed CCD 4×4㎜Square NO No Laser 2,000mW 10×,20×,50×,100 Dark Field
Pattern Water 2380×1800×2300(8″/12″) 12sheet/hr(5min/w) 0.1 Multi-Channel CCD 2×2㎜Square Yes Yes Laser 2,000mW 5×,10×,20×,50×,100 Dark / Bright Field

Wafer Chip LED Inspector

VISION SYSTEMS
APPLICATION

We’re advancing to the finest quality product with high technology and abiding faithfulness.
System Specifications
  • Power : AC 220v (60Hz) / Single Phase, 20A,
  • Compressed Air : 0.5MPa
  • Dimermm : 1500㎜ × 900㎜ × 1700㎜ (WDH) ➜ Inspection System
  • Dimermm : 1100㎜ × 900㎜ × 1700㎜ (WDH) ➜ Cutting System
  • Weight : About 600kg
Reject unit processing
  • No Good Unit ➜ Pen Marking
System Sequence

Roller Feeding ➜ Stris Cutting ➜ Inspection ➜ No

Good unit reject marking ➜ Manual Unloading

※ BLU : LCD Back Light Unit

Inspection Item
  • Top Side : Metal Chip, Black Spot, Contamination, Foreign Material, Terminal Pressing, Scratch, Burr
  • Bottom Side : Contamination, Abnormalform
Inspection Accuracy 50㎛ (Depend on User requirement)
Tact Time Avg 6sec / 1strip (Based on 4×26 Unit Lead Frame)
Application BLU, Side View LED, Any kind of LED Package

COF Film Inspection Model : HWI-CBI 1000

VISION SYSTEMS
APPLICATION

We’re advancing to the finest quality product with high technology and abiding faithfulness.
Specification
Machine Size(㎜) 2100(l)×800(w)×1800(h)
Inspection Items Organic Particle
Throughtput 3Hour/1Reel(5PE)

(20 Point Auto review included)

Accuracy 3.45㎛/pixel
Detector Area CCD Camera
Inspection object Type COF/TCP
lllumination xenon light
Working Environment Class 10(Clean line)
Operation - inspects Bump area inside a device
- Inspects all devices
Review applied 5×Zoom Microscope
For inquiry, contact HIMA sales dept.(TEL.82-32-821-2511 or sales@hims.co.kr)